Modeling Capabilities

Thermal stress analysis of die-solder interface & Package sidewalls.

Left: Thermal stress analysis of die-solder interface. Right: Thermal stress analysis of package sidewalls.




Thermal Analysis Process

SolidWorks Cad Designs;
2-D Analysis 3-D FEA Modeling Simulation / Optimization Thermal Imaging Verification

Simplify system to a network of thermal resistances.

Use thermal spreading calculations to determine minimum part spacing.

Specify and select an initial heat removal system.

Build a precise computer model of the system.

Break the model into small solution domains through “meshing”.

Apply materials and relevant thermal properties.

Simulate to obtain temperature distribution.

Vary the heat sink dimensions, airflow, component spacing, and layout to obtain desired thermal results.

Re-simulate and compare.

Test the fully fabricated design under simulated thermal conditions.

Use thermal imaging camera to obtain temperature distribution.

Compare to simulated results, and alter the CAD model to match actual results.