SILICON CARBIDE MOTOR DRIVES
The power density of current motor drive systems is a major limitation in hybrid and fully electric vehicles.
The weight and volume of the electronics and corresponding heat transfer systems are a key concern, particularly in demanding
applications such as military motor drives and high-performance electric automobiles. The primary goals of this technology are:
| 1 |
Significantly increase the power density over conventional systems (5 - 10x) with silicon carbide (SiC) based technology |
| 2 |
Integrate power and control electronics in a single package utilizing the multi-chip power module (MCPM) approach |
| 3 |
Operate at high-temperatures (up to 300 °C) to reduce mass, size, and weight of the heat transfer system |
| 4 |
Either operate at (1) high-temperatures with no significant sacrifice in reliability, or (2) low temperatures with a marked improvement
in reliability |
| 5 |
Integrate directly with the motor, increasing drive and sense signal quality while removing unnecessary cabling |
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APEI, Inc. is currently utilizing SiC and HTSOI electronics to develop compact and reliable motor drives capable
of operating to device junction temperatures in excess of 300 °C. The use of SiC modules for these applications will allow for: 1) high-temperature
operation capability (reduced thermal management requirements/reduced weight), 2) high-frequency and high-surge current capabilities (reduced weight
and volume), and 3) inherent radiation hardening for aircraft and space applications. The development and application of SiC
power electronics technology also has the potential to solve many of the technical problems now facing military platforms, including reducing the size
and weight of power generation and supply systems, increasing power density and power delivery capability, and improving power efficiency. All of
these advantages directly translate into lighter armed forces with increased mobility, lethality, and survivability.