CAREER OPPORTUNITIES

Job Description

We currently have a job vacancy for a Senior Power Electronics Module Design Engineer in our Power device development team. This position is located in our Fayetteville, AR technology center.

 

This job opportunity is for an advanced and experienced Senior Power Electronics Module Design Engineer with a thorough and detailed understanding of power module design. This position is a part of Cree’s power electronics packaging team, and the applicant must be intimately knowledgeable of, able to plan for, and able to lead/ perform a wide range of design, development, and research duties.

 

Education and Experience

The job opportunity is for an advanced technical position with the possibility of some management requirements. A BS engineering degree with a minimum of 15+ years of experience in the specific field is required, or a Ph.D. with 10+ years of experience in the specific field is required.


Duties & Responsibilities

  • Lead research, design, and developmental efforts for power discrete packages, power modules, and multichip power modules
  • Interface with power electronics engineers, electrical engineers, process engineers, and production engineers to develop power modules that meet electrical, mechanical, long term reliability, and cost requirements (concept to production)
  • Building and testing of prototypes and proof of feasibility
  • Participate and contribute to the contract proposal writing process and the commercial customer bid process
  • Technical lead, PI, and project manager on projects and contracts
  • Mentor and aide to Jr. and mid-level engineers
  • Mentor and aide to packaging technicians at all levels
  • Travel to present at technical conferences
  • Travel to meet with program officers and commercial customers
  • Interface with manufacturing (internal and external) to transfer designs

Knowledge, Skills, Abilities

  • Detailed and in-depth understanding of the complete power module product cycle, from concept to market: how to design to performance, manufacturability, and cost
  • Excellent communication, writing, presentation, and relation skills a must
  • Knowledge and capability to efficiently use a wide variety of software programs essential to the job (Electronics packaging and analysis tools, such as SolidWorks, Flotherm, COMSOL, ANSYS, Ansoft, Saber, OrCAD, etc.
  • Extensive in-depth expertise in hands-on use of laboratory equipment, performing reliability testing, building prototypes, etc. (experience with LabView is a plus)
  • Technical project management, project planning, etc.
  • Extreme environment electronics packaging (high temperature and cryogenic)
  • High power, high voltage, and high current packaging
  • Wire bond interconnects
  • Die attaches, brazing, epoxies
  • Power substrates
  • Low temperature co-firable (LTCC) ceramics
  • Integrated passives
  • Flip chip, BGA, etc.
  • Ribbon and other interconnect bonding
  • Thermal management and analysis for concentrated heat fluxes, techniques, software, and tools
  • Thermal-stress analysis, techniques, software, and tools
  • PCB and power layout techniques, software, and tools
  • Parasitic package extractions and modeling, techniques, software, and tools
  • Hermetic sealing, laser welding, seam sealing, etc.
  • Knowledge of advanced packaging materials
  • Ceramic / metal packages, housings
  • High temperature plastics, plastic fatigue, outgassing, mechanical design, etc.
  • Electrolytic and electroless plating
  • Reliability testing and analysis
  • Vacuum and conveyor solder reflow systems
  • Fixture design and fabrication

Additional Skills that are a Plus:

  • Knowledge of new state-of-the-art devices such as SiC JFETs, SiC MOSFETs, SiC TMOS, SiC Thyristors, SiC Schottky Diodes, etc.
  • Knowledge of commercial and military systems for weapons platforms, aerospace platforms, automotive platforms, etc. into which power electronics subsystems are designed
  • Experience with proposal writing or the bid & proposal process for government contracting
  • Experience serving as an R&D principal investigator (PI) or program/project manager
 
Overview

 

At Cree, we’re a little obsessed. We’re fascinated by how things work and how we can make them work better. Our products enable systems that are more powerful and efficient than previously thought possible, because we’re constantly looking for ways to push past the limits of today’s technology.

 

Our devices are built on silicon carbide, a material that has vastly expanded the capabilities of electronic components.  Our power division is the world’s leading manufacturer of silicon-carbide Schottky diodes and MOSFETs for efficient power conversion. These devices provide increased efficiency, higher switching frequency and reduced system size and weight in a variety of applications, including power supplies and solar inverters.

 

Our RF division is a proven leader in high performance and reliable gallium-nitride components for wireless amplifiers. We fabricate transistors and MMICs that drastically reduce overall energy consumption. Our wide-band, RF-operating semiconductors enable enhanced performance while reducing the number of required amplifiers. Our RF group supports several applications including wireless infrastructure, RADAR and defense technologies.

 

The Cree-Fayetteville facility is a high-technology, aggressive, internationally competitive, fast growing small business located in the foothills of the Ozark Mountains near the University of Arkansas campus. We develop advanced power electronics systems for the military, NASA, down-hole, next generation electric vehicles, and commercial use; including power modules, DC/DC supplies, single and three phase inverters, battery chargers, DC and AC motor drives, etc. We seek energetic and enthusiastic professionals with high ambition, deep motivation, teamwork ethic, and a commitment to being the best of the best in the field of power electronics packaging.

 

We’re looking for bright minds and passionate hearts to help us build a more powerful and energy-efficient world.

Apply for this job online

Job Description

We currently have a job vacancy for an Electronics Test Technician in our Power device development team. This position is located in our Fayetteville, AR technology center.

 

We are looking for a motivated individual who will assist our engineers with reliability, qualification, and characterization testing of our products, as well as equipment operation and maintenance. This position is part of Cree’s test and qualification team, and the applicant must be skilled and proficient with hands-on laboratory testing.

 

Education and Experience

Requires an associate degree with 4+ years of related experience or a Bachelor of Science degree in a technical field, such as Engineering, Engineering Technology, Electronics, Physics, etc.

 

Duties & Responsibilities

  • Analyze and interpret multi-level schematics with the end goal to design and implement a laboratory test setup.
  • Operate a wide variety of electrical test and measurement equipment including multimeters, power supplies, oscilloscopes, RLC meters, switch matrices, DAQ systems, and environmental chambers
  • Overtime and some flexible scheduling are required to meet the demands of this position
  • Other duties as assigned
  • Must be excited to learn new skills if not already experienced in areas such as PCB Layout, parametric analysis, and data analysis

Skills

  • Working knowledge and understanding of electrical safety
  • Working knowledge and understanding of basic electronic theory
  • Must be comfortable with computer-aided test setups
  • Must be detail oriented and able to work on multiple projects concurrently
  • Must be able to manipulate data using software (e.g., Excel, MATLAB, etc.)
  • Neat / organized / can execute and thoroughly document test plans
  • Must be able to logically troubleshoot electronic assemblies down to the component/interconnect level
  • Experience with electronic test standards such as JEDEC, IEC, MIL-STD, or AEC is a plus
  • Experience working with AutoCAD and/or SolidWorks is a plus 
  • Knowledge of failure analysis equipment and procedures such as EDX, SEM, SAM, etc. is a plus
  • Must be able to work effectively with minimal supervision
 
Overview

 

At Cree, we’re a little obsessed. We’re fascinated by how things work and how we can make them work better. Our products enable systems that are more powerful and efficient than previously thought possible, because we’re constantly looking for ways to push past the limits of today’s technology.

 

Our devices are built on silicon carbide, a material that has vastly expanded the capabilities of electronic components.  Our power division is the world’s leading manufacturer of silicon-carbide Schottky diodes and MOSFETs for efficient power conversion. These devices provide increased efficiency, higher switching frequency and reduced system size and weight in a variety of applications, including power supplies and solar inverters.

 

Our RF division is a proven leader in high performance and reliable gallium-nitride components for wireless amplifiers. We fabricate transistors and MMICs that drastically reduce overall energy consumption. Our wide-band, RF-operating semiconductors enable enhanced performance while reducing the number of required amplifiers. Our RF group supports several applications including wireless infrastructure, RADAR and defense technologies.

 

The Cree-Fayetteville facility is a high-technology, aggressive, internationally competitive, fast growing small business located in the foothills of the Ozark Mountains near the University of Arkansas campus. We develop advanced power electronics systems for the military, NASA, down-hole, next generation electric vehicles, and commercial use; including power modules, DC/DC supplies, single and three phase inverters, battery chargers, DC and AC motor drives, etc. We seek energetic and enthusiastic professionals with high ambition, deep motivation, teamwork ethic, and a commitment to being the best of the best in the field of power electronics packaging.

 

We’re looking for bright minds and passionate hearts to help us build a more powerful and energy-efficient world.

Apply for this job online

Job Description

We currently have a job vacancy for an Power Electronics Packaging Engineer in our Power device development team. This position is located in our Fayetteville, ARtechnology center.

 

This job opportunity is for an experienced Electronics Packaging Engineer with a thorough and detailed understanding of a wide variety of packaging design and processing issues with respect to power devices, power modules, and power electronics systems. This position is a part of Cree’s power electronics packaging team, and the applicant must be intimately knowledgeable of, able to plan for, and able to lead/ perform a wide range of developmental and research duties.

 

Education and Experience

The job opportunity is for an advanced technical engineering position. Applicant’s background requires a B.S. engineering degree and 5+ years of experience. Applicants with less experience with a higher level degree and knowledge depth will be given consideration as well.

 

Duties & Responsibilities

  • Develop electronics assembly processes such as wire bonding, die attach, soldering, etc.
  • Perform circuit board prototyping and assembly
  • Assist in conducting experiments and acquiring data
  • Overtime and some flexible scheduling are required to meet the demands of this position
  • Interface with power electronics and electrical engineers to develop packages that meet electrical requirements (prototypes to products)
  • Must be excited to learn new skills

 

Knowledge, Skills, Abilities

  • Working knowledge and understanding of power electronics
  • Must be detail oriented and able to perform multiple projects concurrently
  • Must be very results oriented and be able to perform independently or as a team member under restrictive timeframes
  • Must be a good team player and communicator
  • Knowledge of standard electronics packaging processes, such as wire bonding, die attach, vacuum reflow soldering, etc. Highly skilled at implementing one or more of those processes is a must.
  • Board fabrication such as PCB, DBC, and DBA is desired but not required
  • LTCC, thin film, and thick film ceramic processing is desired but not required
  • Reliability testing and failure analysis is desired but not required
  • Neat / organized / can follow clean room procedures
  • Knowledge and capability to efficiently use a wide variety of software programs essential to the job (Electronics packaging and analysis tools, such as SolidWorks, Flotherm, COMSOL, ANSYS, Ansoft, Saber, OrCAD, etc.
  • Knowledge of new state-of-the-art devices such as SiC JFETs, SiC MOSFETs, SiC Schottky Diodes, etc.
 
Overview

 

At Cree, we’re a little obsessed. We’re fascinated by how things work and how we can make them work better. Our products enable systems that are more powerful and efficient than previously thought possible, because we’re constantly looking for ways to push past the limits of today’s technology.

 

Our devices are built on silicon carbide, a material that has vastly expanded the capabilities of electronic components.  Our power division is the world’s leading manufacturer of silicon-carbide Schottky diodes and MOSFETs for efficient power conversion. These devices provide increased efficiency, higher switching frequency and reduced system size and weight in a variety of applications, including power supplies and solar inverters.

 

Our RF division is a proven leader in high performance and reliable gallium-nitride components for wireless amplifiers. We fabricate transistors and MMICs that drastically reduce overall energy consumption. Our wide-band, RF-operating semiconductors enable enhanced performance while reducing the number of required amplifiers. Our RF group supports several applications including wireless infrastructure, RADAR and defense technologies.

 

The Cree-Fayetteville facility is a high-technology, aggressive, internationally competitive, fast growing small business located in the foothills of the Ozark Mountains near the University of Arkansas campus. We develop advanced power electronics systems for the military, NASA, down-hole, next generation electric vehicles, and commercial use; including power modules, DC/DC supplies, single and three phase inverters, battery chargers, DC and AC motor drives, etc. We seek energetic and enthusiastic professionals with high ambition, deep motivation, teamwork ethic, and a commitment to being the best of the best in the field of power electronics packaging.

 

We’re looking for bright minds and passionate hearts to help us build a more powerful and energy-efficient world.

Apply for this job online

Job Description

We currently have a job vacancy for a Senior Power Electronics Packaging Engineer in our Power device development team. This position is located in our Fayetteville, ARtechnology center.

 

This job opportunity is for an advanced and experienced Senior Electronics Packaging Engineer with a thorough and detailed understanding of a wide variety of packaging design and processing issues with respect to power devices, power modules, and power electronics systems. This position is a part of Cree’s power electronics packaging team, and the applicant must be intimately knowledgeable of, able to plan for, and able to lead/ perform a wide range of developmental and research duties.

 

Education and Experience

The job opportunity is for an advanced technical position with the possibility of some management requirements. A BS degree with a minimum of 15+ years of experience in the specific field is required, or a Ph.D. with 10+ years of experience in the specific field is required.


Duties & Responsibilities

  • Lead package research, design, and developmental efforts for power discrete packages, power modules, multichip power modules, and/or power electronics systems
  • Interface with power electronics and electrical engineers to develop packages that meet electrical requirements      (prototypes to products)
  • Building and testing of prototypes and proof of feasibility
  • Participate and contribute to the contract proposal writing process and the commercial customer bid process
  • Technical lead, PI, and project manager on projects and contracts
  • Mentor and aide to Jr. and mid-level engineers
  • Mentor and aide to packaging technicians at all levels
  • Travel to present at technical conferences
  • Travel to meet with program officers and commercial customers
  • Interface with manufacturing (internal and external) to transfer designs

Knowledge, Skills, Abilities

  • Excellent communication, writing, presentation, and relation skills a must
  • Knowledge and capability to efficiently use a wide variety of software programs essential to the job (Electronics packaging and analysis tools, such as SolidWorks, Flotherm, COMSOL, ANSYS, Ansoft, Saber, OrCAD, etc.
  • Extensive in-depth expertise in hands-on use of laboratory equipment, performing reliability testing, building prototypes, etc. (experience with LabView is a plus)
  • Technical project management, project planning, etc.
  • Extreme environment electronics packaging (high temperature and cryogenic)
  • High power, high voltage, and high current packaging
  • Wire bond interconnects
  • Die attaches, brazing, epoxies
  • Power substrates
  • Low temperature co-firable (LTCC) ceramics
  • Integrated passives
  • Flip chip, BGA, etc.
  • Ribbon and other interconnect bonding
  • Thermal management and analysis for concentrated heat fluxes, techniques, software, and tools
  • Thermal-stress analysis, techniques, software, and tools
  • PCB and power layout techniques, software, and tools
  • Parasitic package extractions and modeling, techniques, software, and tools
  • Hermetic sealing, laser welding, seam sealing, etc.
  • Knowledge of advanced packaging materials
  • Ceramic / metal packages, housings
  • High temperature plastics, plastic fatigue, outgassing, mechanical design, etc.
  • Electrolytic and electroless plating
  • Reliability testing and analysis
  • Vacuum and conveyor solder reflow systems
  • Fixture design and fabrication

Additional Skills that are a Plus:

  • Knowledge of new state-of-the-art devices such as SiC JFETs, SiC MOSFETs, SiC TMOS, SiC Thyristors, SiC Schottky Diodes, etc.
  • Knowledge of commercial and military systems for weapons platforms, aerospace platforms, automotive platforms, etc. into which power electronics subsystems are designed
  • Experience with proposal writing or the bid & proposal process for government contracting

Experience serving as an R&D principal investigator (PI) or program/project manager

 
Overview

 

At Cree, we’re a little obsessed. We’re fascinated by how things work and how we can make them work better. Our products enable systems that are more powerful and efficient than previously thought possible, because we’re constantly looking for ways to push past the limits of today’s technology.

 

Our devices are built on silicon carbide, a material that has vastly expanded the capabilities of electronic components.  Our power division is the world’s leading manufacturer of silicon-carbide Schottky diodes and MOSFETs for efficient power conversion. These devices provide increased efficiency, higher switching frequency and reduced system size and weight in a variety of applications, including power supplies and solar inverters.

 

Our RF division is a proven leader in high performance and reliable gallium-nitride components for wireless amplifiers. We fabricate transistors and MMICs that drastically reduce overall energy consumption. Our wide-band, RF-operating semiconductors enable enhanced performance while reducing the number of required amplifiers. Our RF group supports several applications including wireless infrastructure, RADAR and defense technologies.

 

The Cree-Fayetteville facility is a high-technology, aggressive, internationally competitive, fast growing small business located in the foothills of the Ozark Mountains near the University of Arkansas campus. We develop advanced power electronics systems for the military, NASA, down-hole, next generation electric vehicles, and commercial use; including power modules, DC/DC supplies, single and three phase inverters, battery chargers, DC and AC motor drives, etc. We seek energetic and enthusiastic professionals with high ambition, deep motivation, teamwork ethic, and a commitment to being the best of the best in the field of power electronics packaging.

 

We’re looking for bright minds and passionate hearts to help us build a more powerful and energy-efficient world.

Apply for this job online

Job Description

We currently have a job vacancy for a Power Electronics Module Design Engineer in our Power device development team.  This position is located in our Fayetteville, ARtechnology center.

 

This job opportunity is for an experienced PowerElectronics Module Design Engineer with a thorough and detailed understanding of power module design. This position is a part of Cree’s power electronics packaging team, and the applicant must be intimately knowledgeable of, able to plan for, and able to lead/ perform a wide range of design, development, and research duties.

 

Education and Experience

The job opportunity is for an advanced technical engineering position. Applicant’s background requires a B.S. engineering degree and minimum 5+ years of experience in the specific field. Applicants with a higher level degree and knowledge depth will be given consideration as well.

 

Duties & Responsibilities

  • Interface with power electronics engineers, electrical engineers, process engineers, and production engineers to develop power modules that meet electrical, mechanical, long term reliability, and cost requirements (concept to      production)
  • Perform  research, design, and developmental efforts for power discrete packages, power modules, and multichip power modules
  • Develop electronics assembly processes such as wire bonding, die attach, soldering, etc.
  • Perform power module prototyping and assembly
  • Assist in conducting experiments and acquiring data
  • Overtime and some flexible scheduling are required to meet the demands of this position
  • Must be excited to learn new skills

 

Knowledge, Skills, Abilities

  • Knowledge and capability to efficiently use a wide variety of software programs essential to the job (Electronics packaging and analysis tools, such as SolidWorks, Flotherm, COMSOL, ANSYS, Ansoft, Saber, OrCAD, etc
  • Must be detail oriented and able to perform multiple projects concurrently
  • Must be very results oriented and be able to perform independently or as a team member under restrictive timeframes
  • Must be a good team player and communicator
  • Knowledge of standard electronics packaging processes, such as wire bonding, die attach, vacuum reflow soldering, etc. Highly skilled at implementing one or more of those processes is a must.
  • Board fabrication such as PCB, DBC, and DBA is desired but not required
  • Reliability testing and failure analysis are a plus, but not required
  • Neat / organized / can follow clean room procedures
  • Knowledge of new state-of-the-art devices such as SiC JFETs, SiC MOSFETs, SiC Schottky Diodes, etc.
 
Overview

At Cree, we’re a little obsessed. We’re fascinated by how things work and how we can make them work better. Our products enable systems that are more powerful and efficient than previously thought possible, because we’re constantly looking for ways to push past the limits of today’s technology.

 

Our devices are built on silicon carbide, a material that has vastly expanded the capabilities of electronic components.  Our power division is the world’s leading manufacturer of silicon-carbide Schottky diodes and MOSFETs for efficient power conversion. These devices provide increased efficiency, higher switching frequency and reduced system size and weight in a variety of applications, including power supplies and solar inverters.


Our RF division is a proven leader in high performance and reliable gallium-nitride components for wireless amplifiers. We fabricate transistors and MMICs that drastically reduce overall energy consumption. Our wide-band, RF-operating semiconductors enable enhanced performance while reducing the number of required amplifiers. Our RF group supports several applications including wireless infrastructure, RADAR and defense technologies.

 

The Cree-Fayetteville facility is a high-technology, aggressive, internationally competitive, fast growing small business located in the foothills of the Ozark Mountains near the University of Arkansas campus. We develop advanced power electronics systems for the military, NASA, down-hole, next generation electric vehicles, and commercial use; including power modules, DC/DC supplies, single and three phase inverters, battery chargers, DC and AC motor drives, etc. We seek energetic and enthusiastic professionals with high ambition, deep motivation, teamwork ethic, and a commitment to being the best of the best in the field of power electronics packaging.

 

We’re looking for bright minds and passionate hearts to help us build a more powerful and energy-efficient world.

Apply for this job online