APEI’s current device interconnect capabilities include fine gauge wire and ribbon bonding used for analog, digital, and RF electronics and large gauge wire and ribbon bonding used for high power or high current devices. The fine gauge wire bonding is performed on a K&S 4523 AD with wire diameters ranging from 0.7 mil to 3 mil and ribbon dimension as small as 0.4 by 0.8 mil. The large gauge interconnects are made using an Orthodyne power bonder and includes wire diameters from 3 mils to 20 mils and ribbon up to 40 by 2 mils.