APEI, Inc. employs a number of processes for bare die and component attaches (including oven, box furnace, conveyor oven, and vacuum furnace operations) depending on the particular requirements of the joining system. Standard (eutectic solder, epoxy, etc.) and exotic (specialized epoxies, transient liquid phase bonding, sintering) solid state diffusion techniques are used in order to create strong and reliable bonds. Capabilities include processing temperatures up to 1100°C in a number of oxidizing, inert, or fluxing atmospheres. Specialized fixtures and reflow profiles are tailored by APEI engineers for specific processes and systems.