J. Valle Mayorga, C. Gutshall, K. Phan, I. Escorcia, H. A. Mantooth, B. Reese, M. Schupbach, A. Lostetter, "High Temperature Silicon-on-Insulator Gate Driver for SiC-FET Power Modules", IMAPS International Conference on High Temperature Electronics Network (HiTEN 2011), St. Catherine's College, Oxford, England, July 18-20, 2011

B. McPherson, J. Hornberger, J. Bourne, R. Shaw, E. Cilio, W. Cilio, B. Reese, E. Heinrichs, T. McNutt, M. Schupbach, A.B. Lostetter, "High Temperature Silicon Carbide Power Modules for High Performance Systems", IMAPS International Conference on High Temperature Electronics Network (HiTEN 2011), St. Catherine's College, Oxford, England, July 18-20, 2011

Edgar Cilio, Brice McPherson, Jared Hornberger, Alex Lostetter, Marcelo Schupbach, “High Temperature, High Frequency SiC Power Systems for Aircraft Applications,” GOMACTech Government Microcircuit Applications and Critical Technology Conference 2011, Orlando, Florida, March 21-24, 2011.

A. Escobar, M. Saadeh, J. Balda, J. Bourne, Y. Feng, and H. Mantooth, “A Methodology to Coordinate Solid-State Fault Current Limiters with Conventional Protective Devices.” IEEE PSCE 2011 Conference.

Edgar Cilio, Brice McPherson, Gavin Mitchell, Alex Lostetter, Marcelo Schupbach, “High Temperature, High Frequency SiC Three Phase Inverter for Aircraft Applications,” SAE Power Systems Conference 2010, Fort Worth, Texas, November 2-4, 2010.

H. A. Mantooth and A. Lostetter, “Technical Project Management— Lessons Learned and Best Practices”, 2010 American Society for Engineering Management 31st Annual Conference, Rogers, Arkansas, October 13-16, 2010.

B. Reese, B. McPherson, R. Shaw, J. Hornberger, R. Schupbach, A. Lostetter, B. Rowden, A. Mantooth, S. Ang, J. Balda, K. Okumura, and T. Otsuka, “High Temperature (250 °C) Silicon Carbide Power Modules With Integrated Gate Drive Boards,” International Conference on High Temperature Electronics (HiTEC 2010), Albuquerque, New Mexico, May 11-13, 2010.

B. Reese, R. Shaw, J. Hornberger, R. Schupbach, and A. Lostetter, “High Temperature (230 °C) Isolated Power Supply,” International Conference on High Temperature Electronics (HiTEC 2010), Albuquerque, New Mexico, May 11-13, 2010.

B. McPherson, J. Hornberger, J. Bourne, A. Lostetter, R. Schupbach, R. Shaw, B. Reese, B. Rowden, K. Okumura, T. Otsuka, A. Mantooth, S. Ang, J. Balda , "Packaging of High Temperature 50 kW SiC Motor Drive Modules for Hybrid-Electric Vehicles." Advancing Microelectronics 37.1 (2010): 20-26.

Rowden, B., A. Mantooth, S. Ang, A. Lostetter, J. Hornberger, and B. McPherson, “High temperature SiC power module packaging,” Proceedings of the ASME 2009 International Mechanical Engineering Congress & Exposition (IMECE2009), pp. 1-6, November 13-19, 2009, Lake Buena Vista, Florida, USA.

B. McPherson, J. Hornberger, J. Bourne, A. Lostetter, R. Schupbach, R. Shaw, B. Reese, B. Rowden, K. Okumura, T. Otsuka, A. Mantooth, S. Ang, J. Balda, "Packaging of High Temperature 50 kW SiC Motor Drive Modules for Hybrid-Electric Vehicles", IMAPS 2009, Pages 663-670 San Jose, CA, November 2009.

G. Mitchell, E. Cilio, R. Shaw, B. McPherson, A. Lostetter, R. Schupbach, “High Temperature and High Efficiency SiC based Inverter”, HiTEN 2009, Oxford UK, September 14-16, 2009.

J. Fraley, B. Western, B. McPherson, R.M. Schupbach, A.B. Lostetter, J. Hornberger, J. Yang, “High Temperature SiC Wireless Telemetry Systems”, HiTEN 2009, Oxford UK, September 14-16, 2009.

A. Lostetter, J. Hornberger, B. McPherson, B. Reese, R. Shaw, M. Schupbach, B. Rowden, A. Mantooth, J. Balda, T. Otsuka, K. Okumura, and M. Miura, “High-Temperature Silicon Carbide and Silicon on Insulator Based Integrated Power Modules”, 2009 IEEE Vehicle Power and Propulsion Conference, Dearborn, Michigan, September 7-11, 2009.

A.B. Lostetter, “High Temperature 250 °C SiC Power Modules”, 2009 SEMI Forum Japan, Osaka Japan, May 2009. Invited Speaker.

Bourne, J. Schupbach, M. Carr, J. Mantooth, H.A. Balda, J., "Initial development of a solid-state fault current limiter for naval power systems protection," Electric Ship Technologies Symposium, 2009. ESTS 2009. IEEE , vol., no., pp.491-498, 20-22 April 2009.

Edgar Cilio, Gavin Mitchell, Marcelo Schupbach, and Alexander B. Lostetter, “SiC Intelligent Multi Module DC/DC Converter System for Space Applications,” 2009 IEEE Aerospace Conference, Big Sky, Montana, March 9-13, 2009.

J. Yang, J. Fraley, B. Western, M. Schupbach, A.B. Lostetter, “Characterization of SiC JFETs and its Application in Extreme Temperature (over 450 ºC) Circuit Design”, ICSCRM 2009, Nuremburg Germany, appears in Material Science Forum, Vol 647 (2010), pp. 949-953, 2010.

Gavin Mitchell, Edgar Cilio, Marcelo Schupbach, and Alexander B. Lostetter, “Digital Control of High Temperature SiC Power Modules Utilizing HTSOI”, SAE 2008 Power Systems Conference, Bellevue, Washington, November 11-13, 2008.

Gavin Mitchell, Edgar Cilio, Bradley A. Reese, Roberto M. Schupbach, and Alexander B. Lostetter, “A Reconfigurable Fault-Tolerant Multi Module Converter System Utilizing HTSOI and SiC Technology”, IECON 2008, Orlando, Florida, November 10-13, 2008.

R. K. Rajgarhia, B. McPherson, J. Hornberger, A. B. Lostetter, and A. Saxena, “Thermal Stress Analysis in a Multilayer Power Module,” IMAPS 2008, Pages 1134-1140 Providence, Rhode Island, November 4-6, 2008.

R. Shaw, B. McPherson, J. Hornberger, A. Lostetter, K. Okumura, T. Otsuka, “Thermal Verification of a High-Temperature Power Package Utilizing Silicon Carbide Devices,” IMAPS 2008, Pages 1152-1159 Providence, Rhode Island, November 4-6, 2008.

M. Nawaz, C. Zaring, J. Bourne, M. Schupbach, M. Domeji, H. Lee, M. Ostling, "Assessment of High and Low Temperature Performance of SiC BJTs," 2008 ECSCRM Conference; Barcelona, Spain.

Pinyuen Chen, Tiee-Jian Wu, and Jie Yang, "A Comparative Study of Model Selection Criteria for the Number of Signals". IET Radar, Sonar & Navigation, Vol. 2, June 2008, pp 180-188.

E. Cilio, J. Hornberger, R. Schupbach, A.Lostetter, H. Alan Mantooth, “A High-Temperature (225 °C+) Silicon-On-Insulator (SOI) Gate Driver IC For Silicon Carbide (SiC) JFET”, International Conference on High Temperature Electronics (HiTEC 2008), Albuquerque, New Mexico, May 12 - 15, 2008.

Bradley A. Reese, Brice McPherson, Robert Shaw, Jared Hornberger, Roberto M. Schupbach, and Alexander B. Lostetter, “High Temperature (300 °C) SOI/SiC Based DC-DC Converter Suite”, Government Microcircuit Applications & Critical Technology Conference (GOMACTech 08), Las Vegas, Nevada, March 19-22, 2008.

Jack Bourne, Roberto Schupbach, Brent Hollosi, Jia Di, Alexander Lostetter, and H. Alan Mantooth, “Ultra-Wide Temperature (-230 °C to 130 °C) DC-Motor Drive with SiGe Asynchronous Controller”, 2008 IEEE Aerospace Conference, Big Sky, Montana, March 3-10, 2008.

Jie Yang and Tapan K. Sarkar, "Acceleration-Invariance of Hyperbolic Frequency Modulated Pulse Compression". Digital Signal Processing, Vol. 18, March 2008, pp 228-235.

Jie Yang, Mary C. Taylor, Yu Zhang and Tapan K. Sarkar, "Efficient Interpolation of High Frequency Domain Data by Phase Smoothing." Radio Science, accepted for publication.

Jie Yang, Mary C. Taylor, Yu Zhang and Tapan K. Sarkar, "Interpolation of High Frequency Data by Using Matrix Pencil and Green’s Function". 2008 IEEE AP-S International Symposium on Antennas and Propagation, accepted.

Bradley Reese, Marcelo Schupbach, Alex Lostetter, Brian Rowden, Robert Saunders, Juan Balda, “High Voltage, High Power Density Bi-Directional Multi-Level Converters Utilizing Silicon and Silicon Carbide (SiC) Switches,” Applied Power Electronics Conference and Exposition (APEC 2008), Austin, Texas, February 24-28, 2008.

Bradley A. Reese, Brice McPherson, Robert Shaw, Jared Hornberger, Roberto M. Schupbach, and Alexander B. Lostetter, “High-Temperature SOI/SiC-Based DC-DC Converter Suite,” International Journal of Power Management Electronics, vol. 2008, Article ID 520580, 6 pages, 2008.

Jie Yang, Tapan K. Sarkar and Paul Antonik, "Applying the Fourier-Modified Mellin Transform (FMMT) to Doppler-Distorted Waveforms". Digital Signal Processing, Vol. 17, Nov. 2007, pp1019-1029.

Jie Yang and Tapan K. Sarkar, "A Novel Doppler-Tolerant Polyphase Codes for Pulse Compression Based on Hyperbolic Frequency Modulation". Digital Signal Processing, Vol. 17, Nov. 2007, pp1030-1039.

Jie Yang and Tapan K. Sarkar, "Interpolation/Extrapolation of RCS Data in Frequency Domain Using the Cauchy Method". IEEE Transactions on Antennas and Propagation, Vol. 55, Oct. 2007.

Bradley A. Reese, Brice McPherson, Jared Hornberger, Roberto M. Schupbach, Alexander B. Lostetter, “High Temperature SOI/SiC Based Power Electronic Converters,” The International Conference on High Temperature Electronics (HITEN), Oxford, UK, September 2007.

Roberto Schupbach, Jack Bourne, Jared Hornberger, Alex Lostetter, “10kW Silicon Carbide (SiC) Based Inverter for Renewable Energy Applications,” Electrical Energy Storage Applications and Technologies Conference (EESAT 2007), San Francisco, California, September 23-26, 2007.

Chilukuri K. Mohan, Kishan G. Mehrotra, Pramond K. Varshney and Jie Yang, "Temporal Uncertainty Reasoning Networks for Evidence Fusion with Applications to Object Detection and Tracking". International Journal of Information Fusion, Vol. 8/3, July 2007, pp 281-294.

Jared M. Hornberger, Edgar Cilio, Brice McPherson, Roberto M. Schupbach, Alexander B. Lostetter, and H. Alan Mantooth, “A Fully Integrated, 4 kW, 3-Phase, SiC Motor Drive Module”, PESC 2007 – 38th IEEE Power Electronics Specialists Conference, Page(s) 1048-1053, Orlando, FL, June 17-21, 2007.

Jie Yang and Tapan K. Sarkar, “Doppler-Invariant Pulse Compression for Targets Moving in an Arbitrary Direction". Microwave and Optical Technology Letters, Vol. 49, June 2007, pp.1449-1453.

Jie Yang, Pinyuen Chen, and Tiee-Jian Wu, "On Estimating the Number of Signals". 2007 IEEE AP-S International Symposium on Antennas and Propagation, Honolulu, Hawaii, June, 2007.

Jie Yang, and Tapan K. Sarkar, "Generating the Wideband High Resolution RCS Data from Sparse and Incomplete Data". 2007 IEEE AP-S International Symposium on Antennas and Propagation, Honolulu, Hawaii, June, 2007.

Jie Yang and Tapan K. Sarkar, "A New Doppler-Tolerant Polyphase Pulse Compression Codes Based on Hyperbolic Frequency Modulation". IEEE Radar 2007, Boston, MA, April 2007.

Jie Yang and Tapan K. Sarkar, "Cancellation of Doppler Distortion in Pulse Compression for Targets Moving in an Arbitrary Direction". IEEE Radar 2007, Boston, MA, April 2007.

John Garrett, Roberto Schupbach, Alexander B. Lostetter, H. Alan Mantooth, “The Development of a Motor Drive Power Stage For Cryogenic Space Environments,” Government Microcircuit Applications & Critical Technology Conference (GOMACTech 07), Lake Buena Vista, Florida, March 19-22, 2007.

Edgar Cilio, Jared Hornberger, Brice McPherson, Roberto Schupbach, Alexander B. Lostetter, “Design and Fabrication of a High Temperature (250 ºC base plate) Single-Phase Silicon-Carbide (SiC) Multichip Power Module (MCPM) Inverter,” Government Microcircuit Applications & Critical Technology Conference (GOMACTech 07), Lake Buena Vista, Florida, March 19-22, 2007.

Western, B., Fraley, J., Hornberger, J., McPherson, B., & Lostetter, A. , “Reliability of Gold Wire Bond Interconnects in High Temperature (450°C), High Sheer Force (14,500 G) Applications.” IMAPS 2007. San Jose, CA. March 11-13, 2007.

John Garrett, Roberto Schupbach, H. Alan Mantooth, Alexander B. Lostetter, “Development of a Motor Drive Power Stage For Extreme Cold Environment,” 2007 IEEE Aerospace Conference, Big Sky, Montana, March 3-10, 2007.

Edgar Cilio, Jared Hornberger, Brice McPherson, Roberto Schupbach, Alexander Lostetter, John Garrett, “A Novel High Density 100kW Three-Phase Silicon Carbide (SiC) Multichip Power Module (MCPM) Inverter,” Applied Power Electronics Conference and Exposition (APEC 2007), Anaheim, California, February 25-March 1, 2007.

Marcelo Schupbach and Alexander Lostetter, “SiC technology will meet the military’s future needs”, RF Design Magazine, Defense Electronics February 2007

Edgar Cilio, Jared Hornberger, Brice McPherson, Roberto Schupbach, Alexander Lostetter, “Design and Fabrication of a High Temperature (250 °C Baseplate), High Power Density Silicon Carbide (SiC) Multichip Power Module (MCPM) Inverter”, IEEE IECON 2006 - 32nd Annual Conference of the IEEE Industrial Electronics Society, Paris, France, November 7-10, 2006.

B. McPherson, J. Garrett, E. Cilio, J. Fraley J. Hornberger, B. Western, S. Mounce, R.M. Schupbach, and A.B Lostetter, “Packaging of an Extreme Environment DC Motor Drive for the NASA Venus Lander”, IMAPS 2006 - 39TH International Symposium on Microelectronics, Page(s) 713-720, San Diego, California, October 8-12, 2006.

J. M. Hornberger, B. McPherson, E. Cilio, R.M. Schupbach, A.B. Lostetter, and H.A. Mantooth, “Packaging of a High-Temperature Silicon Carbide (SiC) Three-Phase 4kW Motor Drive”, IMAPS 2006 - 39TH International Symposium on Microelectronics, Page(s) 721-728, San Diego, California, October 8-12, 2006.

Jie Yang and Tapan K. Sarkar, "Retrieving Phase Response from the Far-Field Power Spectrum of the Wideband Electromagnetic System by Cauchy Method". 2006 Joint IEEE AP-S/URSI/AMEREM Symposium, Albuquerque, NM, July 2006.

John Garrett, Roberto Schupbach, H. Alan Mantooth, Alexander B. Lostetter, “Development of an Extreme Environment DC Motor Drive Full Bridge Power Stage Using Commercial-Off-The-Shelf Components,” 4th International Planetary Probe Workshop, Pasadena, California, June 27-30, 2006.

Edgar Cilio, John Garrett, John Fraley, Brice McPherson, Jared Hornberger, Marcelo Schupbach, Alex Lostetter, “High Temperature Electronics (>485°C) For Venus Exploration,” 4th International Planetary Probe Workshop, Pasadena, California, June 27-30, 2006.

Jared M. Hornberger, Edgar Cilio, Roberto M. Schupbach, Alexander B. Lostetter and H. Alan Mantooth, “A High-Temperature Multichip Power Module (MCPM) Inverter utilizing Silicon Carbide (SiC) and Silicon on Insulator (SOI) Electronics”, PESC 2006 – 37th IEEE Power Electronics Specialists Conference, Page(s) 9-15, Jeju, South Korea, June 18-22, 2006.

Jie Yang and Tapan K. Sarkar, "Doppler-Invariant Property of Hyperbolic Frequency Modulated Waveforms". Microwave and Optical Technology Letters, Vol. 48, June 2006, pp.1174-1179.

J. Hornberger, E. Cilio, B. McPherson, R. Schupbach, A. Lostetter, and A. Mantooth , “A High-Temperature Silicon Carbide (SiC) Mulitchip Power Module (MCPM) Inverter for Down-Hole Applications”, International Conference on High Temperature Electronics (HiTEC 2006), Page(s) 279-286, Santa Fe, New Mexico, May 15 - 18, 2006.

Jie Yang and Tapan K. Sarkar, "Generating a High Resolution Wideband Response using RCS data from Electromagnetic Systems", Proc. 2006 ACES Conference on Applied Computational Electromagnetics, Miami, FL, March 2006.

Jie Yang and Tapan K Sarkar, "Acceleration-Invariant Pulse Compression using Hyperbolic Frequency Modulated Waveforms", 2006 Waveform Diversity and Design Conf, Kauai, HI, January 2006.

J. Hornberger, S. Mounce, R. Schupbach, H. A. Mantooth and A. B. Lostetter, “High-Temperature Silicon Carbide (SiC) Power Switches in Multichip Power Module (MCPM) Applications,” IEEE Industry Applications Society Meeting, 6 pgs., Hong Kong, Oct. 2005.

Roberto Schupbach, Edgar Cilio, Jared Hornberger, Steven Franks, A. Lostetter, “A Very High Temperature (400+ °C) Inverter for Energy Storage Applications Utilizing Silicon on Insulator (SOI) and Silicon Carbide (SiC) Electronics,” Electrical Energy Storage Applications and Technologies Conference (EESAT 2005), San Francisco, California, October 17-19, 2005.

Roberto Schupbach, Jared Hornberger, Alexander Lostetter, Dimos Katsis, Aivars Lelis, “The Design, Fabrication, and Testing of a High Temperature (150 °C) DC-DC Converter,” The International Conference on High Temperature Electronics (HITEN), Paris, France, September 2005.

J. Hornberger, S. Mounce, R. Schupbach, B. McPherson, H. Mustain, A. Mantooth, W. Brown, and A.B. Lostetter, “High-Temperature Integration of Silicon Carbide (SiC) and Silicon-on-Insulator (SOI) Electronics in Multichip Power Modules (MCPMs),” 11th European Conference on Power Electronics and Applications (EPE2005), Dresden Germany, September 2005.

J. Hornberger, B. McPherson, E. Cilio, R.M. Schupbach, S. Mounce, A.B. Lostetter and H.A. Mantooth, “Packaging of a High-Temperature Silicon Carbide (SiC) Mulitchip Power Module (MCPM),” 38th International Symposium on Microelectronics (IMAPS2005), Page(s) 579-585, Philadelphia, Pennsylvania, September 2005.

H.A. Mustain, A.B. Lostetter, W.D. Brown, “Evaluation of Gold and Aluminum Bond Performance for High Temperature (500 ° C) Silicon Carbide (SiC) Power Modules”, The 55th Electronic Components and Technology Conference, Lake Buena Vista, Florida, 2005.

Tsuyoshi Funaki, Tsunenobu Kimoto, Takashi Hikihara, Avinash S. Kashkap, Prasanna Ramavarapu, Sharmila Mounce, Juan C. Balda, and H. Alan Mantooth, “Characterization of Cascode SiC JFET / Si MOSFET Devices”, The 2005 International Power Electronics Conference, Toki Messe, Niigata, Japan, April 4-8, 2005.

Jie Yang and Tapan K. Sarkar, "Application of Fourier-Mellin Transform in Doppler-Distorted Waveforms ", 3rd Annual Waveform Diversity Workshop, Huntsville AL, March 2005.

S. Mounce, B. McPherson, R. Schupbach, A. B. Lostetter, “Ultra-Lightweight, High Efficiency SiC Based Power Electronic Converters for Extreme Environments”, 2005 IEEE Aerospace Conference, Big Sky, Wyoming, March 5-12, 2005.

Jie Yang, Jinhwan Koh and T. K. Sarkar, "Reconstructing a Non-minimum Phase Response from the Far-field Power Pattern of an Electromagnetic System" IEEE Transaction on Antennas and Propagation, Vol. 53, February 2005, pp.833-841.

A. Lostetter and K. Olejniczak, "Advanced Electronic Packaging", 2nd Edition (Chapter 13: Power Electronics Packaging), Edited by W. Brown and R. Ulrich, IEEE Press.

J. Hornberger, A.B. Lostetter, K. J. Olejniczak, S. Magan Lal, and A. Mantooth, "A Novel Three Phase Motor Drive Utilizing Silicon on Insulator (SOI) and Silicon-Carbide (SiC) Electronics for Extreme Environment Operation in the Army Future Combat Systems (FCS)," 37th International Symposium on Microelectronics (IMAPS2004), Long Beach, CA, November 2004.

J. Hornberger, A.B. Lostetter, S. Magan Lal, K.J. Olejniczak, and A. Mantooth, "A High-Temperature 250°C Motor Drive Utilizing Silicon on Insulator (SOI) and Silicon Carbide (SiC) Electronics for Operation in the Army Future Combat Systems (FCS)," 24th Army Science Conference, Orlando FL, November 2004.

Kashyap A.S, Ramavarapu P.L, Magan Lal S., McNutt T.R, Lostetter A.B, Mantooth H.A, "Compact Circuit Simulation Model of a Silicon Carbide Junction Field Effect Transistor", IEEE Workshop on Computers in Power Electronics (COMPEL '04), Urbaba-Champaign Illinois, August 15-18 2004

M. Schupbach, J.C. Balda., "35kW Ultracapacitor Unit for Power Management of Hybrid Electric Vehicles: Bi-directional DC-DC Converter Design," Power Electronics Specialists Conference, 2004. PESC 04. 2004 IEEE 35th Annual, vol. 3, pp 2157- 2163, June 20-25, 2004

R.M. Schupbach, J.C. Balda, "New Energy Storage Unit for Heavy-Duty Vehicles Encompassing Cold-Weather Starting", Power Electronics Specialists Conference, 2004. PESC 04. 2004 IEEE 35th Annual, vol 4, pp 3786- 3791, June 20-25, 2004

Kashyap A.S, Ramavarapu P.L, Magan Lal S., McNutt T.R, Lostetter A.B, Mantooth H.A, "Modeling Vertical Channel Junction Field Effect Devices in Silicon Carbide", Conf. Rec. of IEEE Power Electronics Specialists Conf, Aachen, Germany, June 20-25, 2004.

Jie Yang and Tapan K. Sarkar, "Reconstruction of a Phase Response from Far-Field Power Pattern of an Electromagnetic System" 2004 ACES Conference on Applied Computational Electromagnetics, Syracuse, NY, April 2004.

Hornberger, J.; Lostetter, A.B.; Olejniczak, K.J.; McNutt, T.; Lal, S.M.; Mantooth, A., “Silicon-carbide (SiC) semiconductor power electronics for extreme high-temperature environments,” IEEE Aerospace Conference Proceedings, Volume 4, March 2004, Page(s):2538 - 2555 Vol.4.

A. Mantooth, A. Lostetter, X. Huang, “Demonstrating the Feasibility of Compact Modeling Environmentally Induced Thermal and Radiation Effects on Electrical Devices”, Proceeding of the 2004 IEEE Aerospace Conference, MT, March 2004.

R.M. Schupbach and J.C. Balda, "The role of ultracapacitors in an energy storage unit for power management," in the Vehicular Technology Conference, IEEE 58th, vol. 5, pp. 3236 - 3240, October 6-9, 2003.

A. Lostetter, J. Hornberger, S. Magan Lal, K. Olejniczak, A. Mantooth, and Aicha Elshabini, "Development of Silicon-Carbide (SiC) Static-Induction-Transistor (SIT) Based Half-Bridge Power Converters," Proceedings of the 2003 IMAPS Conference, Boston, MA, October 2003.

A. Lostetter, "Thermal Modeling of Flexible Substrate AC-DC Resonant Half-Bridge Power Converters", Advancing Microelectronics, Vol.30, No.5, Cover Page, September/October 2003.

T. McNutt, A. Lostetter, A. Mantooth, M. Mojarradi, "An SOI CMOS Compatible Thermal Transducer for Low Power Systems-on-a-Chip Data Isolation," Proceedings of Therminic 2003, 9th International Workshop on Thermal Investigations of ICs and Systems, Aix-en-Provence, France, September 2003.

K. Speer, T. McNutt, A. Lostetter, A. Mantooth, K. Olejniczak, "A Novel High Frequency Silicon Carbide, SIT-Based Test-Bed for the Acquisition of SiC Power Device Reverse Recovery Characteristics," Proceedings of the 2003 European Conference on Power Electronics and Applications, Toulouse, France, September 2003.

R.M. Schupbach, J.C. Balda, M. Zolot, and B. Kramer, "Design methodology of a combined battery-ultracapacitor energy storage unit for vehicle power management," Power Electronics Specialist, PESC 2003, vol. 1, pp 88-93, June 15-19, 2003.

R.M. Schupbach, J.C. Balda, M. Zolot, B. Kramer, "Design Methodology of a Combined Battery-Ultracapacitor Energy Storage Unit for Vehicle Power Management," IEEE 34th Annual Power Electronics Special Conference (PESC '03), vol. 1, pp 88-93, Acapulco, Mexico, June 15-19, 2003.

R.M. Schupbach, J.C. Balda, "Comparing DC-DC converters for power management in hybrid electric vehicles," in the Electric Machines and Drives Conference, IEEE International, vol. 3, pp. 1369-1374, June 1-4 2003.

S. Magan Lal, A. Kashyap, T. McNutt, A. Lostetter, A. Mantooth, "Testing and Modeling Electrical Characteristics of Novel Silicon Carbide (SiC) Static Induction Transitors (SITs)," Arkansas Academy of Science Annual Meeting, University of Arkansas, Fayetteville, Arkansas, April 2003.

M. Hossain, E. Cilio, T. McNutt, A. Lostetter, and A. Mantooth, "Parameter Extraction Software for a Compact Diode Model," Arkansas Academy of Science Annual Meeting, University of Arkansas, Fayetteville, Arkansas, April 2003.

S. Magan Lal, A. Kashyap, T. McNutt, A. Lostetter, A. Mantooth, "Testing and Modeling Electrical Characteristics of Novel Silicon Carbide (SiC) Static Induction Transisitors (SITs)," Technical Summit Conference, University of Arkansas, Fayetteville, April 2003.

M. Hossain, E. Cilio, T. McNutt, A. Lostetter, and A. Mantooth, "Parameter Extraction Software for a Compact Diode Model," Technical Summit Conference, University of Arkansas, Fayetteville, Arkansas, April 2003.

Sharmila D. Magan Lal, Avinash S. Kashyap, Ty R. McNutt, Alexander B. Lostetter & H. Alan Mantooth, "Testing and Modeling Electrical Characteristics of Novel Silicon Carbide (SiC) Static Induction Transistors (SITs)", Proceedings of the Arkansas Tech Summit, April 2003.

Sharmila D. Magan Lal, Avinash S. Kashyap, Ty R. McNutt, Alexander B. Lostetter & H. Alan Mantooth, "Testing and Modeling Electrical Characteristics of Novel Silicon Carbide (SiC) Static Induction Transistors (SITs)", Journal of the Arkansas Academy of Sciences, April 2003.

Jie Yang, Chilukur. K. Mohan, Kishan Mehrotra and Pramod K. Varshney, "A Tool for Belief Updating over Time in Bayesian Networks". 5th Intl. Conf. on Tools for A.I., Washington D.C., November. 2002, pp.284-289.

R.M. Schupbach, J.C. Balda, "A versatile laboratory test bench for developing powertrains of electric vehicles," Vehicular Technology Conference, IEEE 56th, vol 3, pp. 1666-1670, September 24-28, 2002.

A. Lostetter, K. Olejniczak, and A. Elshabini, "Novel Silicon-Carbide (SiC) Based Semiconductor Transistors for Use in High Temperature Power Electronics Packaging," Technical Summit Conference, University of Arkansas, Fayetteville, AR, April 2002. Awarded best paper of conference.

T. McNutt, A. Lostetter, and H. A. Mantooth, "An SOI CMOS Thermal Transducer," Technical Summit Conference, University of Arkansas, Fayetteville, AR, April 2002.

T. McNutt, A. Lostetter, and H. A. Mantooth, "A Novel SOI CMOS Compatible Thermal Device Technology," THERMES 2002, California, January 2002.

Z. Hossain, K. J. Olejniczak, H. A. Mantooth, E. Yang and C. Ma, "A Physics-Based MCT Model Using the Lumped-Charge Modeling Technique," IEEE Trans. on Power Electronics, vol. 16, n. 2, pp. 264-271, March 2001.

A. Lostetter, K. Olejniczak, A. P. Malshe, W. D. Brown and A. Elshabini, "The Utilization of Diamond and Diamond-Like Carbon Substrates for High Performance Power Electronic Packaging Applications," in the Proc. of the 2001 European Conf. on Power Electronics and Applic. (EPE '01), Graz, Austria, in press.

A. Lostetter, K. Olejniczak, and A. Elshabini, "Silicon Carbide Power Die Packaging in Diamond Substrate Multichip Power Module Applications," 2001 IMAPS Conference, Baltimore.

A. Lostetter, K. Olejniczak, W. Brown, and A. Elshabini, "The Utilization of Diamond and Diamond-Like Carbon Substrates for High-Performance Power Electronic Packaging Applications", 2001 European Power Electronics Conference," Graz, Austria.

W. L. Ng, S. S. Ang, T. Thach, B. Ivy, F. Barlow, A. Elshabini, K. C. Burgers, K. J. Olejniczak and W. D. Brown, "Investigation of Wirebonds on Insulated-Metal Substrates for Multichip Power Module Applications," in the Proc. of the 33rd Intl. Symp. On Microelectronics - IMAPS 2000, pp. 99-104, Boston, MA, September 20-22, 2000.

A. Lostetter, F. Barlow, and A. Elshabini, "Packaging of Polymer Thick Films (PTF) on Flex Substrate Power Converters," IEEPEP 2000 Conference on Power Electronics Packaging, Boston, July 2000.

A. B. Lostetter, F. Barlow, A. Elshabini, K. J. Olejniczak and S. Ang, "Polymer Thick Film (PTF) and Flex Technologies for Low Cost Power Electronics Packaging," in the Proc. of Intl. Workshop on Integrated Power Packaging, pp. 33-40, Waltham, MA, July 14-15, 2000.

A. Lostetter, F. Barlow, and A. Elshabini, "The Utilization of Polymer Thick Film (PTF) and Flex Technologies for Power Electronic Packaging," Proceedings of the 2000 International Symposium on Microelectronics and Packaging, Israel, June 2000.

G.G. Karady, G. T. Heydt, K. J. Olejniczak, H. A. Mantooth, S. Iwanoto and M. L. Crow, "Role of laboratory education in power engineering: is the virtual lab feasible?" in the Proc. of the IEEE PES Summer Meeting, vol. 3, pp. 1471-1477, Seattle, WA, 2000.

W. Brown, A. Elshabini, S. Ang, J. Balda, F. Barlow, R. Couvillion, A. Malshe, R. Malstrom, A. Mantooth, T. Martin, H. Naseem, R. Jones, W. Waite, R. Brown, N. Schmitt, D. Nutter, G. Salamo, L. Schaper, W. Schmidt, R. Selvam, S. Singh, K. Olejniczak, R. Ulrich, J. Yeargan, E. Yaz and W. White, "Curriculum Restructure to Answer Critical Needs in Packaging for Energy Efficiency/Renewable Energy Systems, Wireless, and Mixed-Signal Systems Area," in the Proc. of the 2000 Electronic Components and Technology Conference (ECTC'2000), pp. 1278-1284, Las Vegas, NV, May 21-24, 2000.

H. Quach, S. S. Ang, F. Barlow, A. Elshabini, K. Olejniczak, A. Malshe and W. D. Brown, "A Flip-Chip Power Electronics Packaging Technology on a Flexible Polymeric Substrate," in the Proc. of the 3rd Electronics Packaging Tech. Conf., pp. 302-307, 2000.

Y. Gao, E. E. Yaz , K. J. Olejniczak and Y. I. Yaz, "On State-Dependent Riccati Equation Estimator Performance," in the Proc. of the World Automation Conference 2000, Maui, HI, in press.

M. L. Crow, A. Pahwa , S. K. Starrett, K. J. Olejniczak and S. Sudhoff, "Collaborative Distance Education in Power Engineering," IEEE Trans. on Power Systems, vol. 15, n. 1, pp. 3-8, 2000. Prize paper award.

K. J. Olejniczak, "The Hartley Transform," in The Transforms and Applications Handbook, Second Edition, Alexander D. Poularikas, editor, Richard C. Dorf, editor-in-chief, pp. 4-1 - 4-61, CRC Press/IEEE Press : Boca Raton, FL, 2000.

A. Lostetter, F. Barlow, and A. Elshabini, "The Utilization of Polymer Thick Film (PTF) and Flex Technologies for Low Cost, High Performance Power Electronics Packaging of a DC/DC Down Converter," IMAPS 1999 International Symposium on Microelectronics, Chicago, November 1999.

A. Lostetter, F. Barlow, and A. Elshabini, "An Overview to Integrated Power Module (IPM) Design for Power Electronics Packaging," Journal of Microelectronics Reliability, pp365-379, September 1999. Invited paper.

S. Andreou, E. E. Yaz, K. J. Olejniczak and Y.I. Yaz, "Reduced-Order Estimation of Power System Harmonics Using Set Theory," in the Proc. 1999 Intl. Conf. on Control Applications (CCA '99), pp. 820-825, Kohala Coast, HI, 1999.

E. E. Yaz, Y. Gao and K. J. Olejniczak, "Comparison of Adaptive Filter Performance in Estimating the Noise Statistics for Harmonic Models," in the Proc. of the 38th IEEE Intl. Conf. on Decision and Control (CDC'99), vol. 5, pp. 5070-5075, Phoenix, AZ, 1999.

Y. Gao, E. E. Yaz and K. J. Olejniczak, "SDRE Estimator Performance in a Harmonic Distortion Problem," in the Proc. of the 1999 Allerton Conference on Comm., Control & Computing, pp. 935-936, Monticello, IL, 1999.

M. L. Crow, C. Singh, K. J. Olejniczak, K. Tomsovic, R. Christie, A. Pahwa and K. Y. Lee, "Integrating Research Results into a Power Engineering Curriculum," IEEE Trans. on Power Systems, vol. 14, n. 2, pp. 404-411, 1999.