The electronics assembly line is outfitted to perform power electronic module fabrication for advanced SiC & GaN power modules. This line consist of an SST vacuum reflow oven for void-free die & substrate attach, March Plasma oven for pre-cleaning, and an F&K Delvotec wire bonder for automated bonding. Other tools in this line include a Sikama reflow oven, Polaris seam welder, Keyence microscope, and a Keyence laser scriber for marking components. APEI, Inc. has a full line of capabilities to custom build power electronic modules to meet the customer’s needs.