The power substrate manufacturing line is utilized to process substrates used in our high power modules. Capabilities include patterning, etching, plating, and sectioning of direct bond copper (DBC) or direct bond aluminum (DBA) electronic substrates. The core of the processing line consists of Chemcut’s 2315 series Developer, Etcher, & Stripper. Other tools used in this lab include a Western Magnum laminator, Workhorse UV exposure unit, and a DISCO dicing saw. APEI, Inc. has outstanding capabilities for power substrate fabrication and has the ability to perform quick turn orders.