Hermetically sealed high-temperature discretely packaged transistors and diodes.
APEI, Inc. specializes in developing, marketing, and manufacturing high power density and high efficiency power electronic solutions and products. Within our products and solutions, we utilize a wide range of high performance devices, materials, and technologies from around the globe. State-of-the-art devices include diodes, JFETs, MOSFETs, BJTs, IGBTs, HEMTs, and thyristors built from the most advanced materials, including silicon carbide (SiC), gallium nitride (GaN), and diamond-based technologies.
Hermetically sealed high-temperature discretely packaged transistors and diodes.
Hermetically sealed, high-temperature, half and full bridge power modules.
High performance gate drivers supporting APE’s 100/1000/2000 series power modules.
High power, ultra-lightweight, low profile half and full bridge power modules.
APEI, Inc. develops products and solutions to address a wide range of applications, systems, platforms, and needs, including: